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      LED產品作為皇冠上的明珠，已廣泛地應用在指示、背光、顯示、照明等應用方向，應用領域涵蓋消費類電子業(yè)、汽車業(yè)、廣告業(yè)、交通業(yè)、體育業(yè)、娛樂業(yè)、建筑業(yè)等全方位領域。而LED封裝作為上游產業(yè)，更是重中之重，決定了使用壽命和透光程度。

As the jewel in the crown, LED products have been widely used in indications, backlight, display, luminaire and other applications. The application fields cover consumer electronics, automotive, advertising, transportation, sports, entertainment, construction and other all-round areas. As an upstream industry, LED encapsulation is the top priority, which determines the service life and the degree of light transmission.

LED封裝膠概況/LED Encapsulant Overview

      LED封裝膠是LED封裝材料的總稱，俗稱LED膠水。之前，LED封裝膠的成分主要是普通環(huán)氧樹脂，但因其耐熱、耐紫外能力較弱以致于膠體容易變黃，影響透光效果，而脂環(huán)族環(huán)氧樹脂因具有耐高溫、耐紫外老化等優(yōu)異性能，已經在高端的產品應用上取代了環(huán)氧樹脂。

LED encapsulation adhesive is also called LED encapsulant or LED adhesive. Previously, the main component of LED encapsulant was ordinary epoxy resin, but because of its weak heat and UV resistance, the gel easily turns yellow and affects the light transmission effect. Cycloaliphatic epoxy resin has high temperature resistance, strong UV resistance and excellent anti-aging properties, etc. Thus it has replaced ordinary epoxy resin in high-end product applications.

LED封裝膠發(fā)展歷程/LED Encapsulant History

1960s-1980s 以GaP、GaN為基礎的LED研究獲得突破GaP, GaN-based LED research has achieved breakthroughs
1993  LED全彩化由日亞化工實現 LED full color is realized by Nichia Chemical.
1998  SMD LED封裝工藝出現SMD  LED encapsulation technique appeared.

2008 出現COB封裝工藝 COB encapsulation technique appeared.
2013 出現基于Flip Chip的無引線封裝 Flip Chip-based leadless encapsulation appeared.

LED封裝膠產業(yè)分析/LED Encapsulant Industry Analysis

上游 Upstream Industry

封裝材料：有機硅、環(huán)氧樹脂、PCT

Encapsulation materials: organic silicon, epoxy resin, PCT

LED芯片制造  LED chip manufacture

中游 Midstream Industry

LED封裝 LED encapsulation

下游 Downstream Industry

液晶背光源   LCD backlight

LED顯示屏   LED display

LED車燈      LED car lights

景觀燈飾      Landscape lighting

特殊照明      Special lighting

交通信號燈   Traffic lights

LED封裝膠行業(yè)壁壘/LED Encapsulant Industry Barriers

技術壁壘 Technical barriers

LED封裝生產涉及封裝材料、光學性能測試、自動化工藝技術與控制。

LED encapsulant production involves encapsulation material, optical performance testing, automated technology and control.

資金壁壘 Financial barriers

LED封裝產線和設備的購置與運行需要大量資金。

The purchase and operation of LED encapsulant production line and equipment require a lot of capital.

客戶壁壘 Customer barriers

產業(yè)下游LED顯示屏、背光、汽車等領域客戶較為集中，具有嚴格的供應商認證體系，認證周期長，對企業(yè)的供給能力、資金能力、研發(fā)能力要求嚴格。

In a downstream industry, customers are concentrated in LED display, backlight, automotive and other fields, where there are strict supplier certification system, long certification cycle, as well as strict requirements on the company's supply capacity, capital capacity and R&D capacity.

退出壁壘 Exit barriers

LED封裝產業(yè)前期產線和設備投入較大。

Large investment in early production lines and equipment for the LED encapsulation industry.

 LED封裝膠市場分析/LED Encapsulant Market Analysis

中國LED照明市場規(guī)模 China LED lighting market size

      中國是LED照明產品最大的生產制造國，隨著國內LED照明市場滲透率快速攀升至七成以上，LED照明已基本成為照明應用的剛需，國內的LED照明市場規(guī)模呈現出較全球平均水平更快的增長勢頭。據統計，中國LED照明市場產值規(guī)模由2015年的2596億元增長到2018年的4155億元，年均復合增長率達到16.97%，增速高于全球平均水平。預計到2021年，中國LED照明市場產值有望達到5900億元，2019-2021年仍有望能保持超過12%的年均復合增長水平。

China is the largest manufacturer of LED lighting products. With the domestic LED lighting market penetration rate quickly climbed to more than 70%, LED lighting has become a necessity in lighting application. The domestic LED lighting market size shows a faster growth momentum than the global average. According to statistics, the output value of China's LED lighting market increased from 259.6 billion yuan in 2015 to 415.5 billion yuan in 2018, with a compound annual growth rate of 16.97 percent, higher than the global average. China's LED lighting market is expected to reach 590 billion yuan by 2021. It is still expected to maintain a compound annual growth rate of more than 12% in 2019-2021.

                                    
Picture 1: Chinese LED lighting market size and growth trend from 2016 to 2021
Picture 2: Market share of global LED encapsulantsupply source from 2016 to 2019 (unit: %)

      中國大陸在近10年內承接了全球產業(yè)轉移，根據LEDinside統計，2019年中國大陸在全球LED封裝供給端的市占率達到71%，海外產能主要聚焦于車用照明等相對高端的市場需求，而通用照明、景觀照明、LED顯示和背光等傳統應用大部分來自大陸供應商。

Chinese mainland has undertaken global industrial shift in the past 10 years. According to LEDinside statistics, in 2019 Chinese mainland market share on the global LED encapsulant supply source reached 71%. Overseas production capacity is mainly focused on vehicle lighting and other relatively high-end market demand. General lighting, landscape lighting, LED display, backlighting and other traditional applications mostly come from Chinese mainland suppliers.

      目前中游封裝是我國LED產業(yè)發(fā)展相對成熟的環(huán)節(jié)，國內企業(yè)發(fā)揮規(guī)模優(yōu)勢，自2010年開始進入高速發(fā)展期，2015年后逐漸趨于平穩(wěn)，但仍保持每年10%以上的增速。根據高工LED預測數據，2018年國內LED封裝產值超過1000億元，而2020年預計達1288億元。

At present, the midstream encapsulant industry is a relatively mature link in the development of China's LED industry. Domestic enterprises play the scale advantages. Since 2010 they have begun to enter a period of high-speed development. After 2015 they gradually leveled off, but they still maintain an annual growth rate of more than 10%. According to the forecast data of Gaogong LED, the output value of domestic LED encapsulation will exceed 100 billion yuan in 2018, while it is expected to reach 128.8 billion yuan in 2020.

LED封裝膠行業(yè)發(fā)展趨勢/LED Encapsulant Industry Development Trend

      國內LED封裝材料在研究和應用上都與國外尚有一定的差距。高折光的封裝材料的產品雖然已進入市場，但由于在可靠性方面存在的問題，無法在高質量要求的LED器件上得到應用。高端封裝材料的市場基本上被國外大公司的產品所壟斷。國內所研制或生產的材料和國外產品相比還存在光通量偏低、粘結性差或吸水率偏高等缺點。由于幾大國外企業(yè)控制對國內銷售關鍵原料，以保持自身膠水在市場的壟斷地位，國內企業(yè)需要不斷解決原材料自主合成問題，打破外國公司對原料的壟斷和控制，并在生產設備和工藝上自主創(chuàng)新，防止陷入國外企業(yè)的專利陷阱。隨著市場的推動和大量企業(yè)資金的投入，技術難題將不斷被研發(fā)人員解決，國內的LED封裝膠材料必將趕上進口封裝膠材料。

There is still a certain gap in research and application when comparing the domestic LED encapsulating materials with that of foreign countries. Although the high refractive index encapsulating materials have entered the market, they cannot be applied to high-quality LED devices due to reliability problems. The market for high-end encapsulating materials is basically monopolized by large foreign companies. Compared with foreign products, domestically developed or produced materials still have disadvantages such as low luminous flux, poor adhesion, or high water absorption. As several major foreign companies control their domestic sales of key raw materials in order to maintain their own adhesive market monopoly, domestic companies need to continuously solve the problem of independent synthesis of raw materials, break the monopoly and control of raw materials by foreign companies, and independently innovate production equipment and processes to prevent them from falling into the patent trap of foreign companies. With the promotion of the market and the investment of a large amount of corporate funds, technical problems will continue to be solved by R&D personnel, and domestic LED encapsulating materials will certainly catch up with imported encapsulating materials.